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原文：
$SIVE: "Intent to complete the [NASDAQ] listing process over the next few quarters"

This statement was largely missed by many screeners.

Very material improvement from evaluation, to formal confirmation of timelines. https://t.co/iOceCgJTG4

翻译：
$SIVE：”计划在接下来的几个季度内完成[NASDAQ]上市流程”

这一声明被许多筛选工具忽略了。

从评估到正式确认时间表，这是一项非常重要的改进。 https://t.co/iOceCgJTG4

https://x.com/cfsq143/status/2072214595373252977?s=20

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是否高潮🅰️👆💵
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以太可以加仓，但是总体仓位不能超过5%！

原文：
Just some of the more interesting news I came across recently:

1. MS: Revised China humanoid shipments to reach 50,000 in 2026 from 14,000u and 28,000u earlier this year.

2. MS: Probe cards and test sockets likely to be priced hike (precious metal hikes + severe shortage of test pin capacity)

3. Capacitor price hikes: MLCC, aluminum electrolytic, tantalum, polymer aluminum, film, and super capacitors from Yageo.

4. $META Vistara architecture: Older DDR4 Memory with CXL as memory expansion

5. OpenAI achieved inference optimization breakthrough that halves costs and reduces GPU requirements.

6. LTAs are being signed with MLCC after Samsung signed LTA with US big tech customer

7. Grid power bottlenecks triggered 5x increase ($25B) in Brookfield's financing for $BE fuel cells.

8. Taiwan's chip packaging and testing supply chain includes major OSAT providers such as $ASX, Powertech, Winstek Semiconductor, Chipbond, ChipMOS, and ShunSin.

Dedicated testing companies include KYEC, Ardentec, and Sigurd Microelectronics, while testing interface suppliers include WinWay, MPI, Keystone Microtech, Chunghwa Precision, and Hermes Testing Solutions.

Leadframe makers include Jih Lin Tech, SDI, and CWTC, while major IC substrate suppliers include Unimicron, Kinsus, Nan Ya PCB, and Zhen Ding Tech. (Digitimes)

- Taiwan-based OSAT providers are raising prices
- Memory and IC packaging and testing capacity have both become bottlenecks in the semiconductor supply chain

翻译：
最近我遇到的一些有趣新闻：

1. 摩根士丹利：预计2026年中国人形机器人出货量将达到50,000台，较今年早些时候的14,000台和28,000台有所增加。

2. 摩根士丹利：探针卡和测试插座可能会涨价（由于贵金属价格上涨和测试针容量严重短缺）。

3. 电容器价格上涨：由Yageo生产的MLCC、铝电解、钽、聚合物铝、薄膜和超级电容器。

4. $META Vistara架构：使用较旧的DDR4内存，并通过CXL进行内存扩展。

5. OpenAI实现了推理优化突破，减少了成本并降低了GPU需求。

6. 在三星与美国大科技客户签署长期协议（LTA）后，其他公司也在与MLCC签署LTA。

7. 电网电力瓶颈导致Brookfield为$BE燃料电池提供的融资增加了5倍（250亿美元）。

8.

台湾的芯片封装和测试供应链包括主要的OSAT提供商，如$ASX、Powertech、Winstek Semiconductor、Chipbond、ChipMOS和ShunSin。

专门的测试公司包括KYEC、Ardentec和Sigurd Microelectronics，而测试接口供应商包括WinWay、MPI、Keystone Microtech、Chunghwa Precision和Hermes Testing Solutions。

铅框制造商包括Jih Lin Tech、SDI和CWTC，而主要的IC基板供应商包括Unimicron、Kinsus、Nan Ya PCB和Zhen Ding Tech。（Digitimes）

- 台湾的OSAT提供商正在提高价格
- 内存和IC封装和测试能力已经成为半导体供应链中的瓶颈

以太币 1618-1626 空
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