我的关注

原文：
Wow, $CMXT is up a very normal +469.98% after going public today.

Now valuing it at ~$487.31 billion, up from $85.5 billion.

Did any of my Chinese followers buy into the IPO? https://t.co/TlibjHe799

翻译：
哇，$CMXT 上市当天就上涨了非常正常的 +469.98%。

现在其市值约为 4873.1 亿美元，较之前的 855 亿美元大幅上涨。

我的中国粉丝们，有谁参与了这次 IPO？ https://t.co/TlibjHe799

原文：
Nvidia in talks to backstop $250B worth of OpenAI DC financing.

- Softbank’s SB energy develops 10 GW Ohio campus

- OpenAI signs long term lease

- $NVDA guarantees $250B in financing

- OpenAI discussing separate agreement to buy up to $350B in Nvidia chips.

Not quite sure if this circular financing is healthy long term, but given the massive size of AI infrastructure spending…

Feels like capex beneficiaries will be extremely happy.

翻译：
Nvidia 正在谈判为价值 2500 亿美元的 OpenAI 数据中心融资提供担保。

- Softbank 的 SB 能源开发了 10GW 的俄亥俄州校园

- OpenAI 签署了长期租赁协议

- $NVDA 担保了 2500 亿美元的融资

- OpenAI 正在讨论一项单独的协议，以购买高达 3500 亿美元的 Nvidia 芯片。

不太确定这种循环融资长期来看是否健康，但考虑到巨大的 AI 基础设施支出……

感觉资本支出受益者将会非常高兴。

原文：
Just some TLDR news:

- $CXMT IPO tomorrow if you like Chinese memory.

- Samsung Electronics reportedly struggling to secure large FC-BGA substrates. Ibiden (4062) reportedly requested LTA guarantees, Samsung Electro-Mechanics sought prepayments.

- Samsung + $AVGO sign memory + foundry AI framework through 2030, expected to exceed $200b

- $SOI expects FY2027 silicon photonics revenue to double compared to the previous year, surpassing Morgan Stanley's 60% growth projection. Photonics thesis go brrr.

- SK Group + $NVDA sign $500B+ partnership to build out AI DCs and HBM4 memory.

- SKC Absolics glass core delay to 2027 from reports. Targeting final reliability testing EOY, mass production next year. So if you're curious, this does push back some ramps from $LPK and others (hence drop on ER).

- $QCOM price hikes by double digits for smartphone processors, due to upstream supplier hike pricing.

- $META expected to issue $12B in project-level/SPV financing for El Paso, Texas AI DC expansion

- Naver announced a $10 billion investment from $NVDA and Brookfield to construct a 1GW-scale AI Factory. Near term plan is 200MW by 2028. (Nvidia $1B investment, Brookfield nonbinding $9B)

- 64GB DDR5 server modules rises 146% versus end-June contract pricing

- $INTC brought forward 14A process mass production by a year, risk production H2 2027 and volume production in 2028, vs. 2029 HVM expectations.

- Samsung Electro-Mechanics wins $200m MLCC order (existing bottleneck).

- $AMD (the Bandana bottleneck), announces Helios is in full production with shipments Q3 2026. Including an up to 2GW MI455X GPU deployment with Anthropic and a 6GW infrastructure rollout with OpenAI. Gave new >50% CAGR TAM to $220B by 2030 from $26b in 2025 for CPU market.

Rolls out optical interconnects for Mi500 in 2027. From channel checks, AMD is heading down to the CPO route (seems

likely to use Ayar).

- $ORCL wins $7B Department of War enterprise software contract

- JX metal doubles semi target capacity at its KR subsidary with a 4B yen investment, with operations to begin H2 2027, amid surging demand from major customers Samsung Electronics and SK Hynix

- Tungsten hexafluoride spot prices surged 2.1-2.5x Y/Y following Japan's Kanto Denka and Chuo Gas announcing permanent production halts. Fluorinated liquid supply faces a vacuum as 3M plans to exit PFAS production.

- From the four optical chipmaker earnings, Yuanjie/Eoptolink/TFC Optical/Dongshan Precision: no major order cuts, 1.6T shipments expected to accelerate into 2027. Optical chip suppliers expected to capture outsized margins from shortages.

- Unitree Robotics Targets 30,000 Humanoid Robot Production Capacity by 2026. Read through on humanoid TAM scaling like $CCXI and others.

- Energy storage lithium batteries orders increase first half orders by 2,900% apparently in China. Not as familiar with EVE Energy and other battery makers.

翻译：
以下是一些简短的新闻：

- $CXMT 的 IPO 将于明天进行，如果你对中国内存感兴趣。

- 据报道，三星电子公司正在努力确保大型 FC-BGA 基板。Ibiden (4062) 要求 LTA 保证，三星 Electro-Mechanics 寻求预付款。

- 三星和 $AVGO 签署了一个通过 2030 年的内存和代工 AI 框架协议，预计将超过 2000 亿美元。

- $SOI 预计 2027 财年的硅光子学收入将比上一年翻倍，超过摩根士丹利的 60% 增长预测。光子学论文正在迅速发展。

- SK 集团和 $NVDA 签署了 5000 亿美元以上的合作伙伴关系，以建设 AI 数据中心和 HBM4 内存。

- SKC Absolics 玻璃核心延迟到 2027 年，目标是年底进行最终可靠性测试，明年开始大规模生产。如果你感兴趣，这将推迟一些公司（如 $LPK）的扩张计划（因此导致财报下降）。

- $QCOM 智能手机处理器的价格将增加两位数，因为上游供应商提高了价格。

- $META 预计将发行 120 亿美元的项目级/SPV 融资，以扩建德克萨斯州埃尔帕索的 AI 数据中心。

- Naver 宣布从 $NVDA 和 Brookfield 获得 100 亿美元的投资，以建设一个 1GW 规模的 AI 工厂。近期计划是到 2028 年实现 200MW 的容量。（Nvidia 投资 10 亿美元，Brookfield 非约束性投资 90 亿美元）。

- 64GB DDR5 服务器模块的价格比 6 月份的合同价格上涨了 146%。

- $INTC 将 14A 工艺的大规模生产提前了一年，风险生产将在 2027 年下半年开始，2028 年开始大规模生产，之前预计 2029 年开始大规模生产。

- 三星 Electro-Mechanics 获得了 2 亿美元的 MLCC 订单（现有瓶颈）。

- $AMD （头巾瓶颈），宣布 Helios