原文：
Serenity 白毛女-中文翻译（公开）
Serenity 白毛女-中文翻译（公开）
原文：
Just some TLDR news:
- $CXMT IPO tomorrow if you like Chinese memory.
- Samsung Electronics reportedly struggling to secure large FC-BGA substrates. Ibiden (4062) reportedly requested LTA guarantees, Samsung Electro-Mechanics sought prepayments.
- Samsung + $AVGO sign memory + foundry AI framework through 2030, expected to exceed $200b
- $SOI expects FY2027 silicon photonics revenue to double compared to the previous year, surpassing Morgan Stanley's 60% growth projection. Photonics thesis go brrr.
- SK Group + $NVDA sign $500B+ partnership to build out AI DCs and HBM4 memory.
- SKC Absolics glass core delay to 2027 from reports. Targeting final reliability testing EOY, mass production next year. So if you're curious, this does push back some ramps from $LPK and others (hence drop on ER).
- $QCOM price hikes by double digits for smartphone processors, due to upstream supplier hike pricing.
- $META expected to issue $12B in project-level/SPV financing for El Paso, Texas AI DC expansion
- Naver announced a $10 billion investment from $NVDA and Brookfield to construct a 1GW-scale AI Factory. Near term plan is 200MW by 2028. (Nvidia $1B investment, Brookfield nonbinding $9B)
- 64GB DDR5 server modules rises 146% versus end-June contract pricing
- $INTC brought forward 14A process mass production by a year, risk production H2 2027 and volume production in 2028, vs. 2029 HVM expectations.
- Samsung Electro-Mechanics wins $200m MLCC order (existing bottleneck).
- $AMD (the Bandana bottleneck), announces Helios is in full production with shipments Q3 2026. Including an up to 2GW MI455X GPU deployment with Anthropic and a 6GW infrastructure rollout with OpenAI. Gave new >50% CAGR TAM to $220B by 2030 from $26b in 2025 for CPU market.
Rolls out optical interconnects for Mi500 in 2027. From channel checks, AMD is heading down to the CPO route (seems
Just some TLDR news:
- $CXMT IPO tomorrow if you like Chinese memory.
- Samsung Electronics reportedly struggling to secure large FC-BGA substrates. Ibiden (4062) reportedly requested LTA guarantees, Samsung Electro-Mechanics sought prepayments.
- Samsung + $AVGO sign memory + foundry AI framework through 2030, expected to exceed $200b
- $SOI expects FY2027 silicon photonics revenue to double compared to the previous year, surpassing Morgan Stanley's 60% growth projection. Photonics thesis go brrr.
- SK Group + $NVDA sign $500B+ partnership to build out AI DCs and HBM4 memory.
- SKC Absolics glass core delay to 2027 from reports. Targeting final reliability testing EOY, mass production next year. So if you're curious, this does push back some ramps from $LPK and others (hence drop on ER).
- $QCOM price hikes by double digits for smartphone processors, due to upstream supplier hike pricing.
- $META expected to issue $12B in project-level/SPV financing for El Paso, Texas AI DC expansion
- Naver announced a $10 billion investment from $NVDA and Brookfield to construct a 1GW-scale AI Factory. Near term plan is 200MW by 2028. (Nvidia $1B investment, Brookfield nonbinding $9B)
- 64GB DDR5 server modules rises 146% versus end-June contract pricing
- $INTC brought forward 14A process mass production by a year, risk production H2 2027 and volume production in 2028, vs. 2029 HVM expectations.
- Samsung Electro-Mechanics wins $200m MLCC order (existing bottleneck).
- $AMD (the Bandana bottleneck), announces Helios is in full production with shipments Q3 2026. Including an up to 2GW MI455X GPU deployment with Anthropic and a 6GW infrastructure rollout with OpenAI. Gave new >50% CAGR TAM to $220B by 2030 from $26b in 2025 for CPU market.
Rolls out optical interconnects for Mi500 in 2027. From channel checks, AMD is heading down to the CPO route (seems
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