原文：

原文：
$TSM Vice President of Advanced Packaging:

"Foundries can scale up the optical engine, but the real bottlenecks to large scale deployment lie elsewhere...

Including lasers, optical fiber, fiber-optic connectors, and test" (UDN)

Just some bucket ideas:

Lasers: $LITE, $SIVE, $COHR, LandMark (3081), LuxNet, Sumitomo, Furukawa
Optical fiber / FAU: Foci, Browave, $GLW, Sumitomo
Fiber Optic / CPO Connectors: BizLink, $GLW , Fujikura, Nextronics, COXOC
CPO testing: MPI (6223), Advantest, $FORM, Msscorps, $KEYS, Chroma

(disclosure: exposure to theme above, individual names not named by TSMC)

There are others I like as well, such as ShunSin, which now has explicit TSMC COUPE exposure but probably belongs under a different category like packaging/integration.

eg. "Foxconn unit ShunSin confirms TSMC COUPE partnership"

I don't think there's anything too new vs. H1, aside from ongoing news (eg. FAU looks like there will have a demand imbalance in 2027, from a report last week).

But it's helpful to reiterate overall beneficiaries from time to time...

翻译：
$TSM 高级封装副总裁：

> “代工厂可以扩大光学引擎规模，但大规模部署的真正瓶颈在其他方面…
> 包括激光器、光纤、光纤连接器和测试”（UDN）

一些概念性名单：

激光器：$LITE、$SIVE、$COHR、LandMark (3081)、LuxNet、Sumitomo、Furukawa
光纤 / FAU：Foci、Browave、$GLW、Sumitomo
光纤 / CPO 连接器：BizLink、$GLW、Fujikura、Nextronics、COXOC
CPO 测试：MPI (6223)、Advantest、$FORM、Msscorps、$KEYS、Chroma

（披露：持有上述主题的敞口，具体公司未被 TSMC 点名）

我还看好其他公司，例如 ShunSin，虽已明确拥有 TSMC COUPE 敞口，但可能更适合归入封装/集成类。

例如：“Foxconn unit ShunSin confirms TSMC COUPE partnership”

相较 H1 并无太多新信息，除了一些持续的新闻（例如上周报告称 FAU 预计在 2027 年出现需求失衡）。

不时重申整体受益者仍有帮助。