原文：

原文：
Missed this mention earlier but IC design insiders reveal that OSAT providers have already warned clients:

"traditional packaging capacity could face a deficit exceeding 20% by 2027" (eg. $AMKR, ethereum:0x041ff0e49f6f774e7dc7bd10ee4a14c00b1d80b2, Powertech as potential beneficaries)

With: "wire bonding equipment" emerging as the primary bottleneck (ASMPT, $KLIC)

-> influx of AI server shipments has triggered a spike in demand for mature chips
-> existing mature packaging capacity at OSATs is being rapidly absorbed
-> securing early access to traditional packaging capacity is now becoming a challenge

Cascading bottleneck patterns are occurring across memory (eg. DDR2, DDR3) and now packaging capacity I guess.

翻译：
之前错过了这条提及，但 IC 设计内部人士透露，OSAT 供应商已经警告客户：

“传统封装产能到 2027 年可能出现超过 20% 的缺口”（例如 $AMKR、ethereum:0x041ff0e49f6f774e7dc7bd10ee4a14c00b1d80b2，Powertech 可能受益）

并指出：“线键合设备”正成为主要瓶颈（ASMPT，$KLIC）

-> AI 服务器出货激增导致对成熟芯片的需求飙升
-> OSAT 现有的成熟封装产能正被快速消化
-> 抢先获取传统封装产能已成挑战

记忆体（如 DDR2、DDR3）以及现在的封装产能正出现层层瓶颈。