others should go brr in 2028.
Serenity 白毛女-中文翻译（公开）
Serenity 白毛女-中文翻译（公开）
others should go brr in 2028.
- $INTC CEO warned last month that helium could hinder the manufacturing costs and delivery times of AI chips
- 3D NAND word lines are shifting from Tungsten to Molybdenum starting at the 375-layer node
- SambaNova secured JPM for AI inference and raised $1B at an $11B valuation.
- HBM prices projections to double in 2027 as $NVDA Rubin platform drives demand.
- $MU provides $500 million in funding to support GlobalWafers' US manufacturing capacity
- $META 'Iris' will enter mass production in September via $AVGO and TSMC and Meta aims to double computing power to 14GW by 2027.
- Largan Precision has secured its first CPO FAU order, mass production slated for middle of next year (kinda indication around Foci and others).
- Samsung and SK Hynix have delayed the implementation of hybrid bonding packaging technology for HBM4 apparently
- Memory costs (DRAM/NAND) have reached 60% of the BOM for sub-$400 smartphones, causing a severe volume contraction.
- SK Hynix successfully rasied $26.5 billion through a Nasdaq ADR
- $TSLA issued procurement guidelines requiring suppliers to reach weekly production of 1,000 units by September and double to 2,000-2,500 by year end for its 3rd gen Optimus robot. Apparently Alliance Technology and A-Link may be in this supply chain harmonic reducers and vision lenses?
Kinda go through all this stuff every day, but don't wanna be a news reporter so just consolidated stuff I found interesting.
翻译：
以下是半年总结的简要版：
- 摩根士丹利认为 $GLW 的玻璃桥梁具有潜力，但短期内难以取代 FAU（如 FOCI）
- $SPCX 的 Starlink Gen 3 将扩大到 10 万台（比前一代扩大 10 倍），可能会为 CCL 的开关供应商带来容量限制
- 预计 PCB 供应短缺将持续到 2028 年，组件短缺和价格上涨已经迫使像 Inventec 这样的 ODM 发布保守的第二季度出货量
- DeepSeek 和 Zhipu 正在开发自定义 ASIC 以绕过 $NVDA（早就料到了）
- Anthropic 已实现 300 亿美元的年收入，并预计在第三季度实现超过 10 亿美元的利润。原来这些前沿实验室比人们想象的更有利可图
- 美国政府迫使 $AAPL 从 $INTC 采购，以换取关税豁免。有点迫使与 TSM 脱离关系
- $TSM 计划到 2028
- $INTC CEO warned last month that helium could hinder the manufacturing costs and delivery times of AI chips
- 3D NAND word lines are shifting from Tungsten to Molybdenum starting at the 375-layer node
- SambaNova secured JPM for AI inference and raised $1B at an $11B valuation.
- HBM prices projections to double in 2027 as $NVDA Rubin platform drives demand.
- $MU provides $500 million in funding to support GlobalWafers' US manufacturing capacity
- $META 'Iris' will enter mass production in September via $AVGO and TSMC and Meta aims to double computing power to 14GW by 2027.
- Largan Precision has secured its first CPO FAU order, mass production slated for middle of next year (kinda indication around Foci and others).
- Samsung and SK Hynix have delayed the implementation of hybrid bonding packaging technology for HBM4 apparently
- Memory costs (DRAM/NAND) have reached 60% of the BOM for sub-$400 smartphones, causing a severe volume contraction.
- SK Hynix successfully rasied $26.5 billion through a Nasdaq ADR
- $TSLA issued procurement guidelines requiring suppliers to reach weekly production of 1,000 units by September and double to 2,000-2,500 by year end for its 3rd gen Optimus robot. Apparently Alliance Technology and A-Link may be in this supply chain harmonic reducers and vision lenses?
Kinda go through all this stuff every day, but don't wanna be a news reporter so just consolidated stuff I found interesting.
翻译：
以下是半年总结的简要版：
- 摩根士丹利认为 $GLW 的玻璃桥梁具有潜力，但短期内难以取代 FAU（如 FOCI）
- $SPCX 的 Starlink Gen 3 将扩大到 10 万台（比前一代扩大 10 倍），可能会为 CCL 的开关供应商带来容量限制
- 预计 PCB 供应短缺将持续到 2028 年，组件短缺和价格上涨已经迫使像 Inventec 这样的 ODM 发布保守的第二季度出货量
- DeepSeek 和 Zhipu 正在开发自定义 ASIC 以绕过 $NVDA（早就料到了）
- Anthropic 已实现 300 亿美元的年收入，并预计在第三季度实现超过 10 亿美元的利润。原来这些前沿实验室比人们想象的更有利可图
- 美国政府迫使 $AAPL 从 $INTC 采购，以换取关税豁免。有点迫使与 TSM 脱离关系
- $TSM 计划到 2028
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